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Global Semiconductor Equipment Billings Increased 23% Year-Over-Year in Q2 2026, SEMI Reports
Ongoing AI Investment Momentum Drove Back-to-Back Quarters of Record Results ...
2026-09-04T    Computer/Electronics   Electronic Components   Semiconductors 
ASUS Expands AI Infrastructure Ecosystem from Cloud to Edge
Strategic collaborations with Intel and AMD help accelerate AI transformation ...
2026-09-04T    Computer Hardware   Computer Networks   Computer/Electronics   Electronic Components 
ASUS Advances AI Factories with Integrated Infrastructure and Operational Governance
Uniting accelerated computing, simulation-validated deployment and AI governance into one continuous AI factory platform ...
2026-09-04T    Computer Hardware   Computer Networks   Computer/Electronics   Electronic Components 
EarFun Unveils Flagship Wave Pro X: The World's First Dual-Coaxial Headphones with Qualcomm® ANC Technology and Auracast™
Featuring Adaptive Hybrid ANC and the all-new DCAA™ Dual-Coaxial Acoustic Architecture, EarFun's new flagship over-ear headphones deliver reference-grade sound and up to 90 hours of battery life. ...
2026-09-04T    Consumer Electronics   Electronic Components   Entertainment   Mobile Entertainment 
Hisense Extends Long-Term UEFA Partnership as Official Partner of UEFA EURO 2028
BERLIN , Sept. 3, 2026 /PRNewswire/ -- Hisense, a leading brand in global consumer electronics and home appliances, announced at IFA 2026 that it will continue its partnership with UEFA as an Official ...
2026-09-03T    Computer/Electronics   Consumer Electronics   Electronic Components 
vivo Announces Global Launch of V80 Lite 5G with a 10000 mAh Battery--Built for Life on the Move
SHENZHEN, China , Sept. 3, 2026 /PRNewswire/ -- vivo today announced the global launch of vivo V80 Lite 5G, a device engineered to give users the confidence to face demanding days and the freedom to ...
2026-09-03T    Computer/Electronics   Consumer Electronics   Electronic Components   Mobile Entertainment 
Silicon Line®, an EverProX® brand, Launches new Ultra-Low-Power SerDes Chipset MSDL™ (MIPI Serial Data Link), Extending 20 Gbps MIPI D-PHY Connectivity to Tens of Meters
New optical/electrical solution aggregates two simultaneous MIPI-DPHY camera streams, at up to 10 Gbps each, over two serialized links while consuming less than 100 mW per link, eliminating bulky cable ...
2026-09-03T    Computer Hardware   Computer/Electronics   Consumer Electronics   Electronic Components 
Hyundai Mobis Accelerates Electrification Push in Europe with Opening of New Plant in Slovakia
- Annual capacity of up to 280,000 PE systems, the "heart of the EV," in … Hyundai Mobis' first PE system production base in Europe - Senior Slovak government officials, including Slovak ...
2026-09-03T    Auto   Electronic Components 
Eliminate costly enclosures: ABB debuts IP66/Type 4X Drives for Australia's harshest industrial environments
New ACS580, ACH580 and ACQ580 IP66/Type 4X drives support food and beverage, HVACR, manufacturing, and water and wastewater applications exposed to harsh environmental conditions. ...
2026-09-03T    Electronic Components   Environmental Products & Services 
SEMI and Silicon Catalyst Aim to Accelerate Global Semiconductor Innovation with Strategic Partnership
Memorandum of Understanding Signed at SEMICON Taiwan 2026 Expands Access to Global Startup Innovation and Industry Resources ...
2026-09-02T    Computer Hardware   Computer/Electronics   Electronic Components   Semiconductors 
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