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SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM
SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM  Contributed to the global AI computing ecosystem via stable mass production across all HBM generations ...
2026-04-26T    Computer/Electronics   Semiconductors 
Zhejiang unicorn ranks grow to 58 as Hangzhou tightens lead, top ranking shows
Province adds three unicorns, expands high-growth pipeline Hangzhou accounts for 83% as new entrants and startups scale up ...
2026-04-24T    Computer/Electronics   Semiconductors 
Arasan Announces immediate availability of its UFS 5.0 Host controller IP
Arasan announces the immediate availability of its UFS 5.0 Host Controller IP. The UFS 5.0 Host IP is already in use by Tester Companies for compliance and production testing. ...
2026-04-23T    Computer/Electronics   Electronic Commerce   Electronic Components   Semiconductors 
MetaOptics achieves a progressive milestone in securing design/evaluation orders for its metalenses and modules from world-class customers
SINGAPORE , April 23, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group")  is pleased ...
2026-04-23T    Computer/Electronics   Electronic Components   Semiconductors 
SK hynix Announces 1Q26 Financial Results
Reports revenues of 52.5763 trillion won, operating profit of 37.6103 trillion won, net profit of 40.3459 trillion won Record-high quarterly performance driven by increased sales of high value-added ...
2026-04-23T    Computer Hardware   Computer/Electronics   Semiconductors 
Arasan acheives the Industrys First ASIL-D Certification for its CAN XL IP Core
Arasan announces the industry's first ASIL-D Certification for its CAN XL IP. The certification also covers Arasan's CAN FD IP and CAN 2.0 IP. ...
2026-04-21T    Auto   Computer/Electronics   Electronic Components   Semiconductors 
RoboSense Unveiled EOCENE SPAD-SoC Architecture and Chipsets Phoenix and Peacock: Ushering the LiDAR Industry into the Image-grade Era of High-Definition 3D Perception
RoboSense debuted the EOCENE SPAD-SoC architecture , enabling rapid incubation of a diverse chipset portfolio while streamlining R&D workflows to deliver significant structural cost advantages. ...
2026-04-21T    Computer Hardware   Computer/Electronics   Semiconductors 
DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Next-Generation Physical AI Compute Platform for Robotics
Collaboration targets DX-M2-based robotic AI infrastructure, expanding into VLA and VLM technologies for next-generation intelligent robots ...
2026-04-21T    Computer/Electronics   Semiconductors 
Mitate Zepto Technica Joins JST's Next-generation Edge AI Semiconductor R&D Program as Social Implementation Partner
- MZT to Lead Product Commercialization through Its Genome-analysis Accelerator "RASEN" - ...
2026-04-20T    Computer/Electronics   Semiconductors 
SK hynix Begins Mass Production of 192GB SOCAMM2 'Setting a New Standard for AI Server Memory Performance'
-     Mass production of 192GB high capacity products designed for the NVIDIA Vera Rubin platform -     Maximizes power efficiency by featuring high density DRAM ...
2026-04-20T    Computer/Electronics   Mining/Metals   Semiconductors 
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