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E&R Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services KAOHSIUNG , Oct. 5, 2026 /PRNewswire/ -- E&R Engineering Corp., (TWSE: 8027) an international provider of semiconductor packaging equipment, announced today the upcoming grand opening of its new ... 2026-10-05T Computer Hardware Computer/Electronics Electronic Components Semiconductors
XtalPi and Fangda Carbon Deploy Predictive AI to Optimize Cost and Material Efficiency in Graphite Electrode Manufacturing The jointly developed AI model has passed comprehensive acceptance testing and is now operating within Fangda Carbon's production workflow. By forecasting performance and screening formulations before ... 2026-10-02T Computer/Electronics Semiconductors
Toshiba Information Equipment (Philippines) Celebrates 30th Anniversary and First Shipment from Expanded Nearline HDD Production Line Expanding production capacity to support growing AI- and cloud-driven demand for high-capacity data center storage ... 2026-10-02T Computer Hardware Consumer Electronics Electronic Components Semiconductors
SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program Accelerates commercialization of robotics AI chip through end-to-end "Spec Hand-off" development Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 ... 2026-10-01T Computer Hardware Computer/Electronics Semiconductors
LG Innotek Accelerates Corporate Transformation Driven by Semiconductor Substrates and Physical AI Building stable earnings resilience with semiconductor substrates Expanding physical AI businesses to secure future growth engines SEOUL, South Korea , Sept. 30, 2026 /PRNewswire/ -- LG Innotek ... 2026-09-30T Computer Hardware Computer/Electronics Electronic Components Semiconductors
Arasan to demonstrate the industry's first MIPI SWI3S™ IP at the MIPI Member meet in Taipei Arasan Chip Systems, announces that it will demonstrate the industries first MIPI SWI3S™ Manager IP and Peripheral IP on Oct 21, 2026 in Taipei ... 2026-09-30T Computer Hardware Computer/Electronics Electronic Components Semiconductors
Delta Electronics Unveils AI Modular Data Center with 800 VDC In-Row Power for NVIDIA Vera Rubin and Microgrid Solutions at Data Center World Asia 2026 SINGAPORE , Sept. 29, 2026 /PRNewswire/ -- Delta Electronics, a global leader in power management and smart green solutions, is attending Data Center World (DCW) Asia 2026 with its new AI Modular Data ... 2026-09-29T Computer Hardware Electronic Components Semiconductors Trade show news
oToBrite Teams Up with SINTRONES at APTA EXPO 2026 to Deliver a Comprehensive Bus Safety Solution HSINCHU , Sept. 29, 2026 /PRNewswire/ -- oToBrite Electronics, a leading automotive Vision AI company, will showcase its latest safety technologies at APTA TRANSform & EXPO 2026 in Chicago, focusing ... 2026-09-29T Auto Consumer Electronics Electronic Components Semiconductors
NX Group Signs Strategic Cooperation Memorandum with India Semiconductor Mission (ISM) to Develop Semiconductor Logistics Infrastructure in India - Supporting India's Semiconductor Ecosystem through Logistics, Contributing to Resilient Supply Chains - ... 2026-09-29T Semiconductors Transportation
SEMIFIVE Secures USD 52 Million AI Accelerator Contract with U.S. Fabless Company, Validating End-to-End ASIC Model in North America First Spec Hand-off project in North America marks SEMIFIVE's largest single contract to date Next-generation data center AI chip to integrate LPDDR6, PCIe Gen5, and Big Die technologies Tape-out ... 2026-09-29T Computer/Electronics Electronic Components Semiconductors

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