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薄到無位放亅傳iPhone 17 Air不設實體SIM卡槽 恐無法內地銷售 @ 2024-11-28T Back Hot News
Keyword:iPhone 17
Concept:
美國科技媒體《The Information》報道,蘋果明年推出的iPhone 17系列,將加入超薄版的「Air」型號,厚度介乎5至6毫米之間,比起目前蘋果最薄、厚度只有6.9...
TheInformation網站指稱,蘋果計畫明年在更多國家地區移除iPhone上的實體SIM卡槽設計,藉此推廣eSIM使用普及度。
Apple 長期以來一直傳出將在明年用iPhone 17 Air(或iPhone 17 Slim)取代iPhone 16 Plus 的消息,
社會中心/王毓珺、吳培嘉台北報導送毛小孩去洗澡、美容,結果帶著傷回家!台北市一間寵物美容店,被民眾投訴,美容過程中,愛犬疑似遭到業者粗暴...
據科技媒體《The Information》報道,蘋果明年推出的iPhone 17系列,其中賣點是超薄手機,iPhone 17 Air機身厚度只有5至6毫米,足以稱為史上最輕薄iPhone,較iPhone 16的7.8...
市場不斷有消息指出,蘋果預計在明年推出的iPhone 17 系列中,移除Plus 機款,換提供超薄型號iPhone 17 Air。只不過針對iPhone 17 Air 的超薄設計,...
外界盛傳,蘋果將在明年推出主打超薄設計的iPhone 17 Air,取代原有的iPhone 17 Plus。對此《彭博社》名記者Mark Gurman 於最新專欄爆料蘋果開發iPhone...
2016 年,我們告別了3,5 毫米插孔連接器,去年告別了Lightning,明年我們可能會再次告別iPhone。至少他是這麼說的…
蘋果、三星為開拓新市場,不約而同開發超薄慧手機,三星超薄新機最快明年春天發表,有望助力台積電、大立光、雙鴻、GIS-KY、晶技等供應鏈領頭沖一波。
分析師Jeff Pu在報告中提到,iPhone 17、iPhone 17 Air首發搭載A19晶片,iPhone 17 Pro和iPhone 17 Pro Max首發搭載A19 Pro晶片,這兩顆晶片都是基於...

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