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Supermicro Launches New Server Solutions with Intel Xeon 6+ Processors to Reduce TCO and Accelerate Time-to-Online for Large-Scale Cloud and Data Centers 12 new systems across Hyper, SuperBlade ® , FlexTwin ™ , and GrandTwin ® families offer industry-leading core density with up to 576 efficiency cores per server Breakthrough performance-per-watt ... 2026-06-01T Computer Hardware Computer/Electronics Electronic Components Telecommunications
Infineon Joins NVIDIA's MGX™ AI Factory Ecosystem to Transform Power Delivery Architecture for Next-Generation AI Server Racks MUNICH , May 29, 2026 /PRNewswire/ -- Infineon Technologies (FSE: IFX) (OTCQX: IFNNY), a leading provider of power systems and IoT, has joined NVIDIA's MGX AI Factory ecosystem to help transform ... 2026-05-29T Computer Hardware Computer/Electronics Electronic Components
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026 SAN JOSE, Calif. , May 29, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor ( ASIC ) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem ... 2026-05-29T Computer/Electronics Electronic Components Semiconductors Trade show news
ABB report shows how a 0.2 percent motor efficiency gain could unlock billions for industry Report examines a decade of data for over 1,000 large motors and generators delivered globally by ABB's Västerås facility in Sweden The specification gap between standard and Top Industrial ... 2026-05-28T Computer/Electronics Electronic Components Mining/Metals
Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution including support for AP Memory's Xccela™ PSRAM and the latest LVpSRAM™ ... 2026-05-28T Computer Hardware Computer/Electronics Electronic Components Semiconductors
AuthenX to Unveil Detachable 2D FAU Technology at COMPUTEX 2026, Eliminating the Optical Packaging Bottleneck for Next-Gen AI and HPC Clusters Integrating 12-inch CMOS Meta-Lenses into a multi-row 2D array, AuthenX delivers ultra-low loss and high alignment tolerance to seamlessly scale 3.2T to 12.8T CPO deployments. ... 2026-05-28T Computer/Electronics Electronic Components Semiconductors
Powermat Technologies and Anker Innovations Announce Patent License Agreement and Strategic Collaboration TEL AVIV, Israel and SHENZHEN, China , May 28, 2026 /PRNewswire/ -- Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker ... 2026-05-28T Computer/Electronics Consumer Electronics Electronic Components Internet Technology
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI and HPC Accelerate Demand for Advanced Packaging Technologies ... 2026-05-27T Computer/Electronics Electronic Components Semiconductors
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies To exhibit two types of large FC‑BGA substrates for AI applications and innovative ... 2026-05-27T Computer Hardware Computer/Electronics Electronic Components Semiconductors
Bulletin from the Extraordinary General Meeting of AB Electrolux The Extraordinary General Meeting of AB Electrolux was held in Stockholm on May 27, 2026 ... 2026-05-27T Computer/Electronics Consumer Electronics Electronic Components

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